8

 2005 Semtech Corp.

www.semtech.com

SC1565

POWER MANAGEMENT

Introduction

The SC1565 is intended for applications such as

graphics cards where high current capability and very low

dropout voltage are required. It provides a very simple,

low cost solution that uses very little pcb real estate.

Additional features include an enable pin to allow for a

very low power consumption standby mode, and a fully

adjustable output.

Component Selection

Input capacitor: a 4.7µF ceramic capacitor is

recommended. This allows for the device being some

distance from any bulk capacitance on the rail.

Additionally, input droop due to load transients is reduced,

improving load transient response. Additional capacitance

may be added if required by the application.

Output capacitor: a minimum bulk capacitance of 2.2µF,

along with a 0.1µF ceramic decoupling capacitor is

recommended. Increasing the bulk capacitance will

improve the overall transient response. The use of

multiple lower value ceramic capacitors in parallel to

achieve the desired bulk capacitance will not cause

stability issues. Although designed for use with ceramic

output capacitors, the SC1565 is extremely tolerant of

output capacitor ESR values and thus will also work

comfortably with tantalum output capacitors. For refer-

ence, the phase-margin contour of Figure 1 can be used

to choose an appropriate output capacitor for a given

stability requirement.

Noise immunity: in very electrically noisy environments,

it is recommended that 0.1µF ceramic capacitors be

placed from IN to GND and OUT to GND as close to the

device pins as possible.

External voltage selection resistors: the use of 1%

resistors, and designing for a current flow

≥ 10µA is

recommended to ensure a well regulated output (thus

R2

≤ 120kΩ).

Applications Information

Thermal Considerations

The power dissipation in the SC1565 is approximately

equal to the product of the output current and the input

to output voltage differential:

()

O

D

I

VOUT

VIN

P

•

−

≈

The absolute worst-case dissipation is given by:

()

)

MAX

(

Q

)

MAX

(

)

MAX

(

O

)

MIN

(

)

MAX

(

)

MAX

(

D

I

VIN

I

VOUT

VIN

P

•

+

•

−

=

For a typical scenario, V

I

V

Thus P

Using this figure, and assuming T

calculate the maximum thermal impedance allowable to

maintain T

R

TT

P

CW

TH J A MAX

J MAX

A MAX

DMAX

()(

)

()

()

()

.

./

−

=

−

=

−

=°

150 70

109

73 4

This should be achievable for the SO-8 package using

pcb copper area to aid in conducting the heat away, such

as one square inch of copper connected to the ground

pins of the device. The SOT-223, TO-220 and TO-263

packages would not require heatsinking. Internal ground/

power planes and air flow will also assist in removing

heat. For higher ambient temperatures it may be neces-

sary to use additional copper area.