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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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LIS331DLTR датащи(PDF) 36 Page - STMicroelectronics |
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LIS331DLTR датащи(HTML) 36 Page - STMicroelectronics |
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36 / 38 page  Package information LIS331DL 36/38 8 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK® is an ST trademark. ECOPACK® specifications are available at: www.st.com. Figure 13. LGA 16: Mechanical Data & Package Dimensions DIMENSIONS REF. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A1 1 0.039 A2 0.800.031 A3 0.20 0.008 D1 2.850 33.150 0.111 0.117 0.123 E1 2.850 33.150 0.111 0.117 0.123 L1 1 0.039 L2 2 0.078 N1 0.50 0.019 N2 1 0.039 T1 0.350 0.013 T2 0.250 0.001 M0.10 0.0039 P1 0.875 0.034 P2 1.275 0.05 k0.05 0.0019 LGA 16 (3x3x1.0mm) Outline and 7983231E mechanical data |
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