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MIC5233 датащи(PDF) 14 Page - Microchip Technology |
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MIC5233 датащи(HTML) 14 Page - Microchip Technology |
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14 / 24 page ![]() MIC5233 DS20006033E-page 14 2018-2022 Microchip Technology Inc. and its subsidiaries RECOMMENDED LAND PATTERN Dimension Limits Units C Contact Pad Spacing Contact Pitch MILLIMETERS 2.30 BSC MIN E MAX 5.90 Contact Pad Length (X4) Contact Pad Width (X3) Y1 X1 2.15 0.95 Microchip Technology Drawing C04-2032 Rev D NOM 3-Lead Plastic Small Outline Transistor (DB) [SOT-223] 12 C E X1 Y1 X2 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M 1. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: E1 Contact Pitch 4.60 BSC E1 Contact Pad Width X2 3.25 3 SILK SCREEN |
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