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MCP1643 датащи(PDF) 8 Page - Microchip Technology |
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MCP1643 датащи(HTML) 8 Page - Microchip Technology |
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8 / 28 page ![]() MCP1643 DS20005208B-page 8 2013-2023 Microchip Technology Inc. and its subsidiaries 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. 3.1 Enable Pin (EN) The EN pin is a logic-level input used to enable or disable device switching. Device has low quiescent current while disabled. A logic high (>75% of VIN) will enable the regulator output. A logic low (<20% of VIN) will ensure that the regulator is disabled. 3.2 Feedback Voltage Pin (VFB) The VFB pin is used to regulate the voltage across the RSET sense resistor to 120 mV, to keep the output LED current in regulation. 3.3 Unconnected Pin (NC) This pin is unconnected. 3.4 Output Voltage Power Pin (VOUT) High current flows through the integrated P-Channel and out of this pin to the output capacitor, LED load and RSET sense resistor. The output voltage must be fil- tered using a 4.7 µF to 20 µF X7R or X5R ceramic capacitor. The value of the output capacitor depends on the load current. 3.5 Switch Node Pin (SW) Connect the inductor from the input voltage to the SW pin. The SW pin carries inductor current and can be as high as 1.6 A typical peak value. The integrated N-Channel switch drain and integrated P-Channel switch source are internally connected at the SW node. 3.6 Power Ground (PGND) and Signal Ground Pins (SGND) The power ground pin is used as a return for the high- current N-Channel switch. The signal ground pin is used as a return for the integrated VFB and error amplifier. The length of the trace from input cap return, output cap return and PGND and SGND should be made as short as possible to minimize noise on the ground pins. The SGND and PGND pins are connected externally. 3.7 Power Supply Input Voltage Pin (VIN) Connect the input voltage source to VIN. The input source should be decoupled to GND with a 4.7 µF minimum capacitor. 3.8 Exposed Thermal Pad (EP) There is no internal electrical connection between the Exposed Thermal Pad (EP) and the PGND and SGND pins. They must be connected to the same potential on the Printed Circuit Board (PCB). TABLE 3-1: PIN FUNCTION TABLE MCP1643 2x3 mm DFN MCP1643 MSOP Symbol Description 11 EN Enable pin. The logic high enables the operation. Do not allow this pin to float. 22 VFB Reference Voltage pin. Connect to the VFB pin, the RSET (LED current set resistor), and the cathode of the LED load. 3 3 NC Unconnected pin. 44 VOUT Boost Converter Output pin. Connect to this pin the anode of the LED load. An output filter capacitor is required. 55 SW Boost and Rectifier Switch Input pin. Connect the boost inductor between SW and VIN. 66 PGND Power Ground Reference pin. 77 SGND Signal Ground Reference pin. 88 VIN Input Supply Voltage pin. A local bypass capacitor is required. 9 — EP Exposed Thermal Pad; must be connected to PGND and SGND. |
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