Applications

TO-220FP is suitable for medium to high-voltage MOSFETs and IGBTs used for:

f

Switching power supplies

f

AC adapters

f

Motor drivers

f

Flat panel display

Reliability Qualification

Amkor devices are assembled with proven reliable semiconductor

materials.

f

Temperature cycle: -55~150°C, 500 cycles

f

High temp bias: 150°C for 1000 hrs

f

Solder dip: 260°C/10s

Test Services

Amkor offers full turnkey business for all power discrete products. We have

the capability to test various types of power devices including MOSFETs,

bipolar transistors, IGBTs, diodes and regulator ICs/intelligent power

devices.

f

Amkor power discrete test capability

▷ Static test (DC)

▷ Dynamic test (AC, switching/Trr, capacitance/Rg)

▷ Destruction test (inductive load/VSUS, I latch, surge, isolation/VIL)

▷ Thermal resistance (ΔVDS, ΔmV, etc.)

f

Program generation/conversion

f

Failure analysis

f

Available test/handling technology

f

Integrated marking, vision inspection and tape & reel services

TO-220FP (Full Pack) is a full pack version of TO-220, which has a

better heat dissipation efficiency through Cu clip structure, and

with mounted package height reduced by 2.8 mm compared to

conventional TO-220NIS package.

TO-220FP

DATA SHEET | POWER PRODUCTS

FEATURES

f

Cu clip interconnect for better heat

dissipation efficiency

f

Mounted package height reduced by

2.8 mm vs. standard TO-220NIS

f

Turnkey with test and packing services

f

Green materials: Pb-free plating &

halogen-free mold compound

NEW DEVELOPMENTS

f

Larger/higher density leadframe strips

f

Environmentally-friendly Pb-free

solder paste

PROCESS HIGHLIGHTS

f

Bare copper leadframe with no plating

f

Interconnect: Cu clips for better

electrical and thermal performance

f

Plating: 100% Matte Sn

f

Marking: Pen-type laser