Key

Si Integrated Heat Spreaders

for fcCSP Packages

Si is an effective alternative to Cu as a heat spreader material.

f

As a result of robust thermal conductivity and ease of processing, Si is an

effective alternative to Cu as a heat spreader material

f

Si Integrated Heat Spreaders (IHS) can be embedded inside the mold, while

exposing its top surface to an external heat sink

Example constructions include:

Si Integrated Heat Spreader

Considerations

Amkor’s package enhancement can

be embedded inside of a mold to

expose the top surface to an

external heat sink.

Embedded and Exposed Si IHS

in a Single-die fcCSP

TECHNOLOGY SOLUTIONS

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Embedded and Exposed Si IHS

in a Side-by-Side Hybrid Structure

Dual Si IHS in a Hybrid Structure

Embedded and Exposed Si IHS

in a Stacked Hybrid Structure

Si Integrated

Heat Spreader (IHS)

Thermal Interface

Material (TIM)

Active Si (Flip Chip

or Wirebond)

Wirebond Die Attach

Material

Flip Chip Die Bump

Wirebond Bondfinger

Substrate

Solder Ball

Wirebond