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AS191-73LF датащи(PDF) 3 Page - Skyworks Solutions Inc. |
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AS191-73LF датащи(HTML) 3 Page - Skyworks Solutions Inc. |
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3 / 4 page ![]() DATA SHEET • AS191-73, AS191-73LF Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 200185 Rev. B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • August 2, 2006 3 V1 V2 J1–J2 J1–J3 0VHIGH Isolation Insertion loss VHIGH 0 Insertion loss Isolation Truth Table All other conditions not recommended. VHIGH = 2.5 to 5 V. Characteristic Value RF input power 6 W max. > 900 MHz, 0/5 V control Control voltage -0.2 V, +8 V Operating temperature -40 °C to +85 °C Storage temperature -65 °C to +150 °C Absolute Maximum Ratings SOT-6 0.074 (1.90 mm) Ref. 0.071 (1.80 mm) 0.052 (1.30 mm) 0.037 (0.95 mm) Ref. 0.122 (3.10 mm) 0.106 (2.70 mm) 0.006 (0.15 mm) 0.000 (0.00 mm) 0.057 (1.45 mm) 0.035 (0.90 mm) 0.020 (0.51 mm) 0.014 (0.350 mm) 0.126 (3.20 mm) 0.087 (2.20 mm) Pin 6 Pin 1 Pin 1 Indicator 0.022 (0.61 mm) 0.004 (0.10 mm) 0.014 (0.26 mm) 0.004 (0.10 mm) 0.012 (0.30 mm) Typ. 5.0° ± 1° 5.0° ± 1° Performance is guaranteed only under the conditions listed in the specifications table and is not guaranteed under the full range(s) described by the Absolute Maximum specifications. Exceeding any of the absolute maximum/minimum specifications may result in permanent damage to the device and will void the warranty. CAUTION: Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce poten- tials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times. Recommended Solder Reflow Profiles Refer to the “Recommended Solder Reflow Profile” Application Note. Tape and Reel Information Refer to the “Discrete Devices and IC Switch/Attenuators Tape and Reel Package Orientation” Application Note. |
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