Data Sheet

LT8615

analog.com

Rev 0

29 of 31

OUTLINE DIMENSIONS

Refer to https://www.analog.com/en/design-center/packaging-quality-symbols-footprints.html for the most recent

package drawings.

16-Lead Lead Frame Chip Scale Package [LFCSP_SS]

3 x 3 mm Body, With Side Solderable Leads

(CS-16-2)

Dimensions shown in millimeters

PIN 1

INDICATOR

(C 0.10 ×0.45°)

3.10

3.00 SQ

2.90

0.30

0.25

0.20

0.25

0.20

0.15

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

SIDE VIEW

16

5

8

9

12

13

4

0.05 MAX

0.02 NOM

0.203 REF

0.30 REF

0.20 REF

0.23

REF

0.825

REF

0.45

REF

COPLANARITY

0.08

0.80

0.75

0.70

0.55

0.45

0.35

0.55

0.45

0.35

0.55

0.45

0.35

PIN 1

INDICATOR

AREA

SEATING

PLANE

FOR PROPER CONNECTION OF

THE EXPOSED PADS, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

(2 ×)

(2 ×)

0.10

(Step Dimension)

RECOMMENDED SOLDER PAD LAYOUT

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.25 ± 0.05

0.20 ± 0.05

0.45 ± 0.05

SQ

0.45 ± 0.05

SQ

3.00 ± 0.05

2.10 ± 0.05

0.75 ± 0.05

0.50

BSC

0.44

BSC

PACKAGE

OUTLINE

TERMINAL LENGTH

0.45 ± 0.10

0.05 REF

0.10 REF

0.203 REF

TERMINAL

THICKNESS

PLATED AREA

DETAIL B

DETAIL B