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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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TC1017 датащи(PDF) 14 Page - Microchip Technology |
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TC1017 датащи(HTML) 14 Page - Microchip Technology |
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14 / 28 page  TC1017 DS20001813G-page 14 2005-2023 Microchip Technology Inc. and its subsidiaries FIGURE 5-3: Power Dissipation vs. Ambient Temperature (SOT-23 Package). FIGURE 5-4: Maximum Current vs. Ambient Temperature (SOT-23 Package). 5.4 Layout Considerations The primary path for heat conduction out of the SC-70/ SOT-23 package is through the package leads. Using heavy, wide traces at the pads of the device will facilitate the removal of the heat within the package, thus lowering the thermal resistance R JA. By lowering the thermal resistance, the maximum internal power dissipation capability of the package is increased. FIGURE 5-5: SC-70 Package Suggested Layout. 0 100 200 300 400 500 600 700 -40 -15 10 35 60 85 110 Ambient Temperature (°C) 0 20 40 60 80 100 120 140 160 -40 -15 10 35 60 85 110 Ambient Temperature (°C) VIN - VOUT = 1V SHDN U1 V IN V OUT GND C1 C2 |
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