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PIC16F87 датащи(PDF) 18 Page - Microchip Technology |
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PIC16F87 датащи(HTML) 18 Page - Microchip Technology |
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18 / 24 page ![]() PIC16F87/88 DS39607B-page 18 2002 Microchip Technology Inc. 7.0 PROGRAM MODE ELECTRICAL CHARACTERISTICS TABLE 7-1: TIMING REQUIREMENTS FOR PROGRAM MODE AC/DC CHARACTERISTICS POWER SUPPLY PINS Standard Operating Procedure (unless otherwise stated) Operating Temperature 0 ≤ TA ≤ +70°C Operating Voltage 2.0V ≤ VDD ≤ 5.5V Characteristics Sym Min Typ Max Units Conditions/Comments General VDD level for Begin Erase, Begin Program operations and EECON1 writes of program memory VDD 2.0 — 5.5 V VDD level for Begin Erase, Begin Program operations and EECON1 writes of data memory VDD 2.0 — 5.5 V VDD level for Bulk Erase, Chip Erase, and Begin Program operations of program and data memory VDD 4.5 — 5.5 V Begin Programming Only cycle time tprog1 1 — — ms Externally Timed, > 4.5V 2 — — ms Externally Timed, < 4.5V Begin Erase tprog2 1 — — ms Externally Timed, > 4.5V 2 — — ms Externally Timed, < 4.5V Bulk Erase cycle time tprog3 2 — — ms Externally Timed Chip Erase cycle time tprog4 8 — — ms Internally Timed High voltage on MCLR and RA4/T0CKI for Program mode entry VIHH VDD + 3.5 — 13.5 V MCLR rise time (VSS to VHH) for Program mode entry tVHHR — — 1.0 µs (RB6, RB7) input high level VIH10.8 VDD — — V Schmitt Trigger input (RB6, RB7) input low level VIL10.2 VDD — — V Schmitt Trigger input RB<7:4> setup time before MCLR ↑ (Program mode selection pattern setup time) tset0 100 — — ns RB<7:4> hold time after MCLR ↑ (Program mode selection pattern setup time) thld0 5 — — µs Serial Program Data in setup time before clock ↓ tset1 100 — — ns Data in hold time after clock ↓ thld1 100 — — ns Data input not driven to next clock input (delay required between command/data or command/ command) tdly1 1.0 — — µs2.0V ≤ VDD < 4.5V 100 — — ns 4.5V ≤ VDD ≤ 5.5V Delay between clock ↓ to clock↑ of next command or data tdly2 1.0 — — µs2.0V ≤ VDD < 4.5V 100 — — ns 4.5V ≤ VDD ≤ 5.5V Clock ↑ to data out valid (during read data) tdly3 80 — — ns Setup time between VDD rise and MCLR rise tpu tset0 — 250 µs |
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