PD77020

Package Information

Data Sheet

© 2023 Microchip Technology Inc. and its subsidiaries

DS60001824A - 13

• Pb-free 100% Matte Tin Finish

• Package Peak Temperature for Solder Reflow (40s maximum exposure)—260 °C (0 °C, −5 °C)

The following figures and tables show the classification reflow profiles and temperatures.

Table 4-3. Classification Reflow Profiles

Profile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Average ramp-up rate (TSmax to Tp)

3 °C/s maximum

3 °C/s maximum

Preheat

Temperature min (TSmin)

100 °C

150 °C

Temperature max (TSmax)

150 °C

200 °C

Time (tsmin to tsmax)

60s to 120s

60s to 180s

Time Maintained

Temperature (TL)

183 °C

217 °C

Time (tL)

60s to 150s

60s to 150s

Peak classification temperature (TP)

210 °C to 235 °C

240 °C to 255 °C

Time within 5 °C of actual peak temperature (tp)

10s to 30s

20s to 40s

Ramp-down rate

6 °C/s maximum

6 °C/s maximum

Time 25 °C to peak temperature

6 minutes maximum

8 minutes maximum

Figure 4-5. Classification Reflow Profiles

Table 4-4. Pb-Free Process—Package Classification Reflow Temperatures

Package Thickness

Volume < 350 mm3

Volume 350–2000 mm3

Volume > 2000 mm3

Less than 1.6 mm1

260 + 0 °C

260 + 0 °C

260 + 0 °C

1.6 mm to 2.5 mm1

260 + 0 °C

250 + 0 °C

245 + 0 °C

Greater than or equal to 2.5 mm1

250 + 0 °C

245 + 0 °C

245 + 0 °C

Note: 

1. Tolerance: The device manufacturer or supplier must assure process compatibility up to and

including the stated classification temperature, that is, the Peak reflow temperature is 0 °C. For

example, 260 °C to 0 °C, at the rated MSL value.

Exceeding the ratings that are mentioned in the preceding table might cause damage to the device.