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EMC1412 датащи(PDF) 39 Page - Microchip Technology

номер детали EMC1412
подробное описание детали  Multiple Channel 1°C Temperature Sensor with Beta Compensation
PDF  46 Pages
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производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

EMC1412 датащи(HTML) 39 Page - Microchip Technology

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 2014-2022 Microchip Technology Inc. and its subsidiaries
DS20005273B-page 39
EMC1412
RECOMMENDED LAND PATTERN
Dimension Limits
Units
Optional Center Pad Width
Optional Center Pad Length
Contact Pitch
Y2
X2
1.70
1.50
MILLIMETERS
0.50 BSC
MIN
E
MAX
Contact Pad Length (X8)
Contact Pad Width (X8)
Y1
X1
0.69
0.28
Microchip Technology Drawing C04-2382A
NOM
8-Lead Very Thin Plastic Dual Flat, No Lead Package (8Q) - 2x3 mm Body [VDFN]
SILK SCREEN
C
Contact Pad Spacing
2.84
Space Between Pads
G1
0.20
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.30
1.00
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
C
X1
Y1
EV
EV
X2
Y2
ØV
E
G1
Contact Pad to Center Pad (X8)
(G2)
0.225 REF
(G2)
12
8



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