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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MICRF112YMM датащи(PDF) 41 Page - Microchip Technology |
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MICRF112YMM датащи(HTML) 41 Page - Microchip Technology |
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41 / 46 page  MICRF112 Package Information Data Sheet © 2024 Microchip Technology Inc. and its subsidiaries DS70005554A - 41 RECOMMENDED LAND PATTERN Dimension Limits Units Center Pad Width Center Pad Length Contact Pitch Y2 X2 1.10 1.40 MILLIMETERS 0.40 BSC MIN E MAX Contact Pad Length (X10) Contact Pad Width (X10) Y1 X1 0.30 0.20 NOM 1 2 10 C Contact Pad Spacing 1.80 Contact Pad to Contact Pad (X8) G2 0.20 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: © 2022 Microchip Technology Inc. Saw Singulated with Pullback Leads Contact Pad to Center Pad (X10) G1 0.20 Microchip Technology Drawing C04-2574 Rev A C X2 Y2 Y1 X1 E G1 G2 SILK SCREEN |
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