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ASM330LHBG1 датащи(PDF) 36 Page - STMicroelectronics |
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ASM330LHBG1 датащи(HTML) 36 Page - STMicroelectronics |
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36 / 130 page ![]() 7 Application hints 7.1 ASM330LHBG1 electrical connections Figure 21. ASM330LHBG1 electrical connections GND or Vdd_IO Vdd_IO GND 100 nF C2 SDO/SA0 RES RES INT1 11 5 7 12 TOP VIEW Vdd INT2 NC NC 14 8 4 Vdd GND 100 nF C1 1 SCL SDA Vdd_IO Rpu Rpu Pull-up to be added Rpu=10kOhm I2C configuration HOST ASM330LHBG1 (1) (1) I2C SPI (3/4-w) / MIPI I3C SM/ Vdd_IO: Recommended 100 nF filter capacitor. Vdd: Recommended 100 nF plus 10 μF capacitors. 1. Leave pin electrically unconnected and soldered to PCB. 2. Connect to Vdd_IO or GND or leave unconnected and soldered to PCB. The device core is supplied through the Vdd line. Power supply decoupling capacitors (C1, C2 = 100 nF ceramic) should be placed as near as possible to the supply pin of the device (common design practice). The functionality of the device and the measured acceleration/angular rate data is selectable and accessible through the SPI/I²C/MIPI I3C ℠ primary interface. The functions, the threshold and the timing of the two interrupt pins for each sensor can be completely programmed by the user through the SPI/I²C/MIPI I3C ℠ primary interface. ASM330LHBG1 Application hints DS14080 - Rev 1 page 36/130 |
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