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MFR4 датащи(PDF) 3 Page - Welwyn Components Limited |
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MFR4 датащи(HTML) 3 Page - Welwyn Components Limited |
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3 / 4 page ![]() Packaging All MFR resistors are supplied tape packed ready for loading on to automatic sequencing and insertion machines. Component wires will not protrude beyond the outside edge of the tapes. Alternative packaging available by request. Lead Formed resistors can also be supplied. Standard options of Lancet, Radial and Goalpost forming are available. Graph 3 – Load for 1000 hours at 70°C: maximum changes Construction The resistance element is a precisely controlled thin film of metal alloy sputtered on to a high purity ceramic core, protected by a moisture-resistant, high dielectric strength coating applied so that terminations remain completely clear. Terminations Material Hot tin dipped copper wire Strength The terminations meet the requirements of IEC 68.2.21 Solderability The terminations meet the requirements of IEC 115-1, Clause 4.17.3.2 Marking 0.5% and 1% tolerance resistors are colour coded with 5 bands, 2% tolerance has 4. IEC 62 colours are used. Solvent Resistance The body protection and marking are resistant to all normal industrial cleaning solvents suitable for printed circuits. 52 f1 f2 6 6 5 f1 – f2 ≤ 1.4 mm Metal Film Resistors MFR Series © Welwyn Components Limited Bedlington, Northumberland NE22 7AA, UK Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com Issue D · 05.07 Welwyn Components 137 CECC 40101-019 CECC 40101-803 Actual Performance Requirements Requirements Maximum Typical Load at commercial rating : 1000 hours at 70°C 3 h p a r G e e S 9 . 0 % R Load at CECC rating : 1000 hours at 70°C R % 2 1 0.5 See Graph 3 Shelf life : 12 months at room temperature R % Not specified Not Specified 0.1 0.07 C ° 5 5 1 t a o r e z C ° 5 5 1 t a o r e z g n it a r e D Short term overload R % 0.5 0.25 0.25 0.01 Climatic R % 2 1 0.5 0.2 6 5 / 5 2 1 / 5 5 6 5 / 5 2 1 / 5 5 y r o g e t a c c it a m il C Long term damp heat R % 2 1 0.5 0.3 Temperature rapid change R % 0.5 0.25 0.25 0.04 Resistance to solder heat R % 0.5 0.25 0.25 0.07 Vibration and bump R % 0.5 0.25 0.1 0.01 Noise. (in a decade of frequency) µV/V Not Specified Not Specified 0.1 0.07 Insulation resistance ohms >1G >1G >1G >1G n i m 0 0 7 n i m 0 0 7 n i m 0 0 5 n i m 0 0 7 s tl o v f o o r p e g a tl o V t s e u q e r n o p u e l b a li a v a a t a D g n il d n a h e s l u P Performance Data - Type MFR 5 |
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