ADV7520NK

Preliminary Technical Data

Rev. PrA | Page 4 of 5

OUTLINE DIMENSIONS

64 PIN LFCSP PACKAGE DIMENSIONS

*COMPLIANT TO JEDEC STANDARDS MO-220-VMMD

EXCEPT FOR EXPOSED PAD DIMENSION

PIN 1

INDICATOR

TOP

VIEW

8.75

BSC SQ

9.00

BSC SQ

1

64

16

17

49

48

32

33

0.45

0.40

0.35

0.30

0.25

0.18

7.50

REF

0.60 MAX

0.60 MAX

4.85

4.70 SQ*

4.55

PIN 1

INDICATOR

0.50 BSC

0.20 REF

12° MAX

0.80 MAX

0.65 TYP

1.00

0.85

0.80

0.05 MAX

0.02 NOM

SEATING

PLANE

EXPOSED PAD**

(BOTTO M VIEW)

+

DIMENSIONS in Millimeters

64 LFCSP (LEAD FRAME CHIP SCALE PACKAGE)

**Note: PAD is CONNECTED to GND

Figure 6. 64-pin LFCSP

Dimensions shown in millimeters

*COMPLIANT TO JEDEC STANDARDS MO-225

WITH THE EXCEPTION TO PACKAGE HEIGHT.

A

B

C

D

E

F

G

J

H

K

10

8

7

6

3

2

1

9

5

4

A1 CORNER

INDEX AREA

TOP VIEW

BALL A1

PAD CORNER

DETAIL A

BOTTOM VIEW

0.75

REF

6.10

6.00 SQ

5.90

SEATING

PLANE

DETAILA

BALL DIAMETER

0.15 MIN

0.35

0.30

0.25

COPLANARITY

0.08 MAX

0.65 MIN

0.50

BSC

4.50

BSC SQ

*1.40 MAX

Figure 7. 76-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

6 mm × 6 mm × 1.4 mm

(BC-76)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temp. Range

Package Description

Package Option

−25°C to +85°C

64-pin Lead Formed Chip Scale Package

CP-64

ADV7520NKBBCZ-80

−25°C to +85°C

76-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

BC-76

ADV7520NKBBCZRL-80

−25°C to +85°C

76-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

BC-76

ADV7520NK/PCBZ

Evaluation Board