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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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LT6004 датащи(PDF) 29 Page - Analog Devices |
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LT6004 датащи(HTML) 29 Page - Analog Devices |
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29 / 32 page  LTC2063/LTC2064/LTC2065 29 Rev. C For more information www.analog.com PACKAGE DESCRIPTION RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 1.60 ±0.05 (4 SIDES) 2.10 ±0.05 3.50 ±0.05 0.70 ±0.05 0.25 ±0.05 0.50 BSC PACKAGE OUTLINE 3.00 ±0.10 (4 SIDES) NOTE: 1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-4) 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. NiPdAu PPF TERMINAL FINISH 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE PIN 1 TOP MARK (NOTE 6) 0.40 ±0.10 BOTTOM VIEW—EXPOSED PAD 1.60 ±0.10 (4-SIDES) 0.75 ±0.05 R = 0.115 TYP 0.25 ±0.05 1 PIN 1 NOTCH R = 0.20 TYP OR 0.25 × 45° CHAMFER 15 16 2 0.50 BSC 0.200 REF 0.00 – 0.05 (UD16 VAR BB) QFN 0119 REV Ø UD Package 16-Lead Plastic QFN (3mm × 3mm) (Reference LTC DWG # 05-08-1782 Rev Ø) Exposed Pad Variation BB |
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