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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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AD8475 датащи(PDF) 40 Page - Analog Devices |
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AD8475 датащи(HTML) 40 Page - Analog Devices |
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40 / 42 page  LTC6363 Family 40 Rev. C For more information www.analog.com PACKAGE DESCRIPTION RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 1.30 ±0.05 (4 SIDES) 2.10 ±0.05 3.50 ±0.05 0.70 ±0.05 0.25 ±0.05 0.50 BSC PACKAGE OUTLINE 3.00 ±0.05 (4 SIDES) NOTE: 1. DRAWING NOT TO SCALE 2. ALL DIMENSIONS ARE IN MILLIMETERS 3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 4. EXPOSED PAD SHALL BE SOLDER PLATED 5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE PIN 1 TOP MARK (NOTE 6) 0.40 ±0.10 BOTTOM VIEW—EXPOSED PAD 1.30 ± 0.10 (4-SIDES) 0.75 ±0.05 0.45 REF R = 0.115 TYP 0.23 ±0.05 1 PIN 1 R = 0.10 TYP 15 16 2 0.50 BSC 0.10 REF 0.00 – 0.05 (RD16) LFCSP 1218 REV B RD Package 16-Lead Plastic LFCSP (3mm × 3mm) (Reference LTC DWG # 05-08-1648 Rev B) |
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