LE B P1MQ

9 Version 1.3 | 2021-04-07

Dimensional Drawing 7)

Further Information:

Approximate Weight:

5,000.0 mg

ESD advice:

The device is protected by ESD device which is connected in parallel to the

Chip.

Notes:

For superior solder joint connectivity results we recommend soldering under

standard nitrogen atmosphere.

Package not suitable for any kind of wet cleaning or ultrasonic cleaning.

Connector:

Molex Pico-SPOX™ Wire-to-Board Header, Part Number 87438-1043

Recommended mating

connector:

Molex Pico-SPOX™ Wire-to-Board Housing, Part Number 87439-1000

Crimp Terminal, Part Number 87421-0000