1999 March 15

18

Philips Semiconductors

Product specification

Brushless DC motor drive circuit

TDF5140A

SOLDERING

Plastic dual in-line packages

The maximum permissible temperature of the solder is 260

°C; this temperature must not be in contact with the joint for

more than 5 s. The total contact time of successive solder waves must not exceed 5 s.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the

specified storage maximum. If the printed-circuit board has been pre-heated, forced cooling may be necessary

immediately after soldering to keep the temperature within the permissible limit.

Apply the soldering iron below the seating plane (or not more than 2 mm above it). If its temperature is below 300

°C, it

must not be in contact for more than 10 s; if between 300 and 400

°C, for not more than 5 s.