2000 May 02

18

Philips Semiconductors

Objective specification

12-bit, 3.0 V, 30 Msps analog-to-digital

interface for CCD cameras

TDA9964

PACKAGE OUTLINE

UNIT

A

max.

Z

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

1.60

0.20

0.05

1.45

1.35

0.25

0.27

0.17

0.18

0.12

7.1

6.9

0.5

9.15

8.85

0.95

0.55

7

0

o

o

0.12

0.1

0.2

1.0

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.75

0.45

SOT313-2

MS-026

136E05

99-12-27

00-01-19

(1)

(1)

7.1

6.9

9.15

8.85

E

Z

0.95

0.55

D

e

E

B

12

D

H

E

H

D

ZD

A

Z E

e

1

48

37

36

25

24

13

θ

A

detail X

L

(A )

3

X

y

c

0

2.5

5 mm

scale

pin 1 index

LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm

SOT313-2