LA M67F.01

DATASHEET

DATASHEET

13 | Version 1.1 | 2023-06-22

Recommended Solder Pad 8)

OHLPY978

Paddesign

for improved

heat dissipation

Cu-area > 16 mm

Cu-Fläche > 16 mm

Wärmeableitung

Padgeometrie

für verbesserte

Lötstopplack

Solder resist

0.8 (0.031)

2.8 (0.110)

2

2

2.8 (0.110)

0.8 (0.031)

All products are packed in a dry pack bag (Moisture Barrier Bag, MBB) according MIL-PRF-81705, after opening the MBB the

products should go to reflow soldering process. Unused remaining LEDs should be protected from environment due to silver

plated soldering terminal. In order to maintain solderability it is recommended to protect the silver plated solder terminals from

corrosive environment before soldering. For superior solder joint connectivity results we recommend soldering under standard

nitrogen atmosphere.