Data Sheet

AD810

Rev. B | Page 5 of 22

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage

±18 V

Internal Power Dissipation

See Figure 2

Output Short-Circuit Duration1

See Figure 2

Common-Mode Input Voltage

±VS

Differential Input Voltage

±6 V

Storage Temperature Range

PDIP

−65°C to +125°C

CERDIP

−65°C to +150°C

SOIC_N

−65°C to +125°C

Operating Temperature Range

AD810A

−40°C to +85°C

5962-9313201MPA

−55°C to +125°C

Junction Temperature

AD810A

145°C

5962-9313201MPA

175°C

Lead Temperature Range (Soldering

60 sec)

300°C

1

Internal short-circuit protection may not be sufficient to guarantee that the

maximum junction temperature is not exceeded under all conditions.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the natural convection junction to ambient thermal

resistance measured in a one-cubic foot sealed enclosure.

Table 3. Thermal Resistance

Package Type

θJA

Unit

N-8

90

°C/W

Q-8

110

°C/W

R-8

150

°C/W

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the AD810 is

limited by the associated rise in junction temperature. To ensure

proper operation, it is important to observe the derating curves

in Figure 2.

2.4

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

–60

–40

–20

0

20

40

60

80

100

120

140

AMBIENT TEMPERATURE (°C)

8-LEAD

CERDIP

8-LEAD

PDIP

8-LEAD

SOIC

Figure 2. Total Power Dissipation vs. Ambient Temperature

ESD CAUTION