LTM8080 datasheet(2/32 Pages) AD

2 / 32 page

LTM4703

Rev. 0

For more information www.analog.com

PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

VIN, SVIN, RUN, PG ...................................................18V

SYNC, PGSET .............................................................6V

VOUT, VOSNS, SET.....................................................6.3V

PHMODE, COMPa, RT.................................................4V

TSENSE+ to TSENSE− (Current) ...................................5mA

Internal Operating Junction Temperature Range

E-Grade, I-Grade.................................... –40°C to 125°C

Storage Temperature Range .................. –55°C to 125°C

Peak Solder Reflow Body Temperature .................250°C

SYNC

GND

BGA PACKAGE

49-PIN (6.25mm × 6.25mm × 5.07mm)

TJMAX = 125°C, θJA = 19.6°C/W, θJCtop = 15.2°C/W,

θJCbottom = 4.0°C/W, WEIGHT = 0.7g

TOP VIEW

TSENSE+ TSENSE–

RUN

SET

VOSNS

SVIN

GND

BANK 1

BANK 2

VIN BANK 4

BANK 3

COMPb

COMPa

INTVCC

AGND

PHMODE

PGSET

CLKOUT

VOUT

θ VALUES ARE DETERMINED BY SIMULATION PER JESD-51 CONDITIONS.

θJA VALUE IS OBTAINED WITH EVALUATION BOARD.

SEE THE TYPICAL PERFORMANCE CHARACTERISTICS SECTION FOR LAB

MEASUREMENT AND DERATING CURVES.

ORDER INFORMATION

(Notes 1, 2)

PART NUMBER

PAD OR BALL

FINISH*

PART MARKING

PACKAGE

TYPE

MSL

RATING

TEMPERATURE RANGE

(SEE NOTE 2)

DEVICE

FINISH CODE

LTM4703EY#PBF

SAC305 (RoHS)

4703

BGA

–40°C to 125°C

LTM4703IY#PBF

SAC305 (RoHS)

4703

BGA

–40°C to 125°C

• Contact the factory for parts specified with wider operating temperature

ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609.

• Recommended LGA and BGA PCB Assembly and Manufacturing

Procedures

• LGA and BGA Package and Tray Drawings

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