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KB4863 датащи(PDF) 6 Page - Kingbor Technology Co |
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KB4863 датащи(HTML) 6 Page - Kingbor Technology Co |
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6 / 19 page ![]() Typical Performance Characteristics MTE Specific Characteristics (Continued) KB4863MTE (Note 17) Power Derating Curve Note 17: This curve shows the KB4863MTE’s thermal dissipation ability at different ambient temperatures given these conditions: 500LFPM + JEDEC board: The part is soldered to a 1S2P 20-lead exposed-DAP TSSOP test board with 500 linear feet per minute of forced-air flow across it. Board information - copper dimensions: 74x74mm, copper coverage: 100% (buried layer) and 12% (top/bottom layers), 16 vias under the exposed-DAP. 500LFPM + 2.5in2: The part is soldered to a 2.5in2, 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it. 2.5in2: The part is soldered to a 2.5in2, 1oz. copper plane. Not Attached: The part is not soldered down and is not forced-air cooled. Non-MTE Specific Characteristics THD+N vs Frequency THD+N vs Frequency THD+N vs Frequency THD+N vs Output Power KingborTechnologyCo.,Ltd TEL:(86)0755-83095458 FAX:(86)0755-88364052 KB4863 6/19 Rev: 1.1 2005-12-05 |
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