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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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ADA4510-2ARMZ-R7 датащи(PDF) 31 Page - Analog Devices |
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ADA4510-2ARMZ-R7 датащи(HTML) 31 Page - Analog Devices |
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31 / 32 page  Data Sheet ADA4510-2 APPLICATIONS INFORMATION analog.com Rev. B | 31 of 32 chanical stresses can arise from differences of coefficient of thermal expansion (CTE), the rate at which different materials expand when exposed to heat. During the soldering process, the rapidly changing high temperatures cause the packaging materials surrounding the silicon die to expand at a different rate from the silicon. This mis- match in expansion exerts mechanical stress on the die, which can affect the component electrical properties and cause performance shift if not mitigated. By baking the PCB assembly for 30 minutes at 125°C after reflow soldering, adverse effects of mechanical stress on the ADA4510-2 can be effectively mitigated ensuring optimal specified performance. Figure 92 shows how the VOS of representative ADA4510-2 opera- tional amplifiers is affected by stimulated high temperature reflow (SHR) and subsequent post solder bake. Figure 92. VOS Shift due to Solder Heat |
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