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Data Sheet S17961EJ2V0DS

RECOMMENDED SOLDERING CONDITIONS

When soldering this product, it is highly recommended to observe the conditions as shown below.

If other soldering processes are used, or if the soldering is performed under different conditions, please make sure

to consult with our sales offices.

Type of Through-hole Device

Process

Conditions

Partial heating method

Pin temperature: 380°C or below, Heat time: 3 seconds or less (per pin).

Cautions 1. During assembly care should be taken to prevent solder or flux from contacting the glass cap.

The optical characteristics could be degraded by such contact.

2. Soldering by the solder flow method may have deleterious effects on prevention of glass cap

soiling and heat resistance. So the method cannot be guaranteed.

NOTES OF HANDLING THE PACKAGES

The application of an excessive load to the package may cause the package to warp or break, or cause chips to

come off internally. Particular care should be taken when mounting the package on the circuit board. You should not

reform the lead frame. We recommend to use a IC-inserter when you assemble to PCB.

supports: 70 mm). Avoid imposing a load, however, on the inside portion as viewed from the face on which the window

(glass) is bonded to the package body.

Note Three-point bending strength test Distance between supports:70mm, Support R:R2mm, Loading

rate:0.5mm/min.

70 mm

70 mm

Load

Load