AD8052ARMZ datasheet(9/24 Pages) AD

9 / 24 page

Data Sheet

AD8051/AD8052/AD8054

Rev. K | Page 9 of 24

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Ratings

Supply Voltage

12.6 V

Internal Power Dissipation1

SOIC Packages

Observe power

derating curves

SOT-23 Package

Observe power

derating curves

MSOP Package

Observe power

derating curves

TSSOP Package

Observe power

derating curves

Input Voltage (Common Mode)

±VS

Differential Input Voltage

±2.5 V

Output Short-Circuit Duration

Observe power

derating curves

Storage Temperature Range (R)

−65°C to +150°C

Operating Temperature Range (A Grade)

−40°C to +125°C

Lead Temperature (Soldering 10 sec)

300°C

1 See Table 5.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Specification is for device in free air.

Table 5. Thermal Resistance

Package Type

θJA

θJC

ΨJT

ΨJB

Unit

8-Lead SOIC

125

°C/W

5-Lead SOT-23

180

1.0

°C/W

8-Lead MSOP

150

2.5

°C/W

14-Lead SOIC

1.9

°C/W

14-Lead TSSOP

120

0.3

°C/W

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the

AD8051/AD8052/AD8054 is limited by the associated rise in

junction temperature. The maximum safe junction temperature

for plastic encapsulated devices is determined by the glass

transition temperature of the plastic, approximately 150°C.

Temporarily exceeding this limit can cause a shift in parametric

performance due to a change in the stresses exerted on the die

by the package. Exceeding a junction temperature of 175°C for

an extended period can result in device failure.

While the AD8051/AD8052/AD8054 are internally short-

circuit protected, this cannot be sufficient to guarantee that the

maximum junction temperature (150°C) is not exceeded under

all conditions. To ensure proper operation, it is necessary to

observe the maximum power derating curves.

AMBIENT TEMPERATURE (°C)

–55

2.0

1.5

1.0

0.5

2.5

MSOP-8

SOIC-8

SOT-23-5

SOIC-14

TSSOP-14

–35

–15

115

Figure 6. Maximum Power Dissipation vs.

Temperature for AD8051/AD8052/AD8054

ESD CAUTION

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