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TDA8941 датащи(PDF) 18 Page - NXP Semiconductors |
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TDA8941 датащи(HTML) 18 Page - NXP Semiconductors |
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18 / 21 page ![]() Philips Semiconductors TDA8941P 1.5 W mono BTL audio amplifier Product specification Rev. 02 — 7 April 2000 18 of 21 9397 750 06864 © Philips Electronics N.V. 2000. All rights reserved. 18. Revision history Table 11: Revision history Rev Date CPCN Description 02 20000407 - Product specification; second version; supersedes initial version TDA8941P-01 of 14 April 1999 (9397 750 04876). Modifications: • Table 1 on page 1:THD: Max value 0.1% changed to → 0.3%; SVRR: Typ value 65 dB → added • Ordering options removed • Section 8 “Functional description”: – Section 8.1 “Input configuration” on page 3 → added. – Section 8.2 “Power amplifier” on page 4: ........, capable of delivering a peak output current of 1.5 A → changed to 2 A. – Section 8.2.1 “Output power measurement” on page 4 → added – Section 8.2.2 “Headroom” on page 4 → added • Section 8.3 “Mode selection”: – Standby mode: VMODE >(VCC − 0.5 V) → changed to (VCC − 0.5 V) < VMODE <VCC; The power consumption of the TDA8941P will be reduced to <0.18 mW → added. – Mute mode: the DC level of the input and output pins remain on half the supply voltage → added; – 2.5 V < VMODE <(VCC − 1.5 V) → changed to 3 V < VMODE <(VCC − 1.5 V) – Section 8.3.1 “Switch-on and switch-off” on page 5 → added. • Section 8.4 “Supply Voltage Ripple Rejection (SVRR)” on page 5 → added • Section 8.5 “Built-in protection circuits” on page 6 → added • Table 5 on page 6: – Ptot value added 1.25 W – VCC(sc) value added 12 V • Table 7 on page 7: VMODE - mute mode - value Min 2.5 → changed to 3 V • Table 8 on page 8: – THD: Max value 0.1% changed to → 0.3% – SVRR; Typ values 65 and 60 dB → added – Rsource changed to → RS in table and associated table notes – Table note [2]: .... 100 mV (RMS).... changed to → ... 700 mV (RMS).... • Figure 3 to 12: figures added • Section 13 “Internal circuitry” on page 12: → added • Figure 13: figure modified • Section 14.1 “Printed-circuit board (PCB)” on page 13: → added • Figure 14: figure added • Section 14.2 “Thermal behaviour and Tamb(max) calculation” on page 15: → added • Section 15 “Test information” on page 15: Section 15.1 → updated • Section 15.2 “Test conditions” on page 15: → added. 01 19990414 - Preliminary specification; initial version. |
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