© 2006 Microchip Technology Inc.

DS21807C-page 21

25XX160A/B

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office

.

PART NO.

X

/XX

X

Lead

Package

Tape & Reel

Device

Device:

25AA160A

25AA160B

25LC160A

25LC160B

16 Kbit, 1.8V, 16 Byte Page SPI Serial EEPROM

16 Kbit, 1.8V, 32 Byte Page SPI Serial EEPROM

16 Kbit, 2.5V, 16 Byte Page SPI Serial EEPROM

16 Kbit, 2.5V, 32 Byte Page SPI Serial EEPROM

Tape & Reel:

Blank

=

T=

Standard packaging

Tape & Reel

Temperature

Range:

I=

E=

-40

°C to+85°C

-40

°C to+125°C

Package:

MS

=

P=

SN

=

ST

=

Plastic MSOP (Micro Small Outline), 8-lead

Plastic DIP (300 mil body), 8-lead

Plastic SOIC (150 mil body), 8-lead

TSSOP, 8-lead

Lead Finish:

Blank

=

G=

Pb-free – Matte Tin (see Note 1)

Pb-free – Matte Tin only

Examples:

a)

25AA160A-I/MS = 16 Kbit, 16-byte page, 1.8V

Serial EEPROM, Industrial temp., MSOP

package

b)

25AA160AT-I/SN = 16 Kbit, 16-byte page, 1.8V

Serial EEPROM, Industrial temp., Tape & Reel,

SOIC package

c)

25LC160BT-I/SN = 16 Kbit, 32-byte page, 2.5V

Serial EEPROM, Industrial temp., Tape & Reel,

SOIC package

d)

25LC160BT-I/ST = 16 Kbit, 32-byte page, 2.5V

Serial EEPROM, Industrial temp., Tape & Reel,

TSSOP package

–

Finish

Note

1:

Most products manufactured after January 2005 will have a Matte Tin

(Pb-free) finish. Most products manufactured before January 2005 will

have a finish of approximately 63% Sn and 37% Pb (Sn/Pb). Please visit

www.microchip.com for the latest information on Pb-free conversion,

including conversion date codes.

X

Temp Range