© 2006 Microchip Technology Inc.

DS21996A-page 39

MCP98242

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body (TSSOP)

α

A2

A

A1

L

c

β

φ

1

2

D

n

p

B

E

E1

10°

5°

0°

10°

5°

0°

β

Mold Draft Angle Bottom

10°

5°

0°

10°

5°

0°

α

Mold Draft Angle Top

0.30

0.25

0.19

.012

.010

.007

B

Lead Width

0.20

0.15

0.09

.008

.006

.004

c

Lead Thickness

0.70

0.60

0.50

.028

.024

.020

L

Foot Length

3.10

3.00

2.90

.122

.118

.114

D

Molded Package Length

4.50

4.40

4.30

.177

.173

.169

E1

Molded Package Width

6.50

6.38

6.25

.256

.251

.246

E

Overall Width

0.15

0.10

0.05

.006

.004

.002

A1

Standoff

0.95

0.90

0.85

.037

.035

.033

A2

Molded Package Thickness

1.10

1.05

1.00

.043

.041

.039

A

Overall Height

0.65

.026

p

Pitch

8

8

n

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS*

INCHES

Units

Foot Angle

φ

0°

4°

8°

0°

4°

8°

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.

Notes:

JEDEC Equivalent: MO-153

Revised 07-21-05

* Controlling Parameter

Drawing No. C04-086

Note:

For the most current package drawings, please

see the Microchip Packaging Specification located

at http://www.microchip.com/packaging