© 2007 Microchip Technology Inc.

DS21952B-page 41

MCP23017/MCP23S17

28-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.

3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

N

28

Pitch

e

0.65 BSC

Overall Height

A

–

–

2.00

Molded Package Thickness

A2

1.65

1.75

1.85

Standoff

A1

0.05

–

–

Overall Width

E

7.40

7.80

8.20

Molded Package Width

E1

5.00

5.30

5.60

Overall Length

D

9.90

10.20

10.50

Foot Length

L

0.55

0.75

0.95

Footprint

L1

1.25 REF

Lead Thickness

c

0.09

–

0.25

Foot Angle

φ

0°

4°

8°

Lead Width

b

0.22

–

0.38

L

L1

c

A2

A1

A

E

E1

D

N

1 2

NOTE 1

b

e

φ

Microchip Technology Drawing C04-073B