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MCP23017T-E/ML датащи(PDF) 39 Page - Microchip Technology

номер детали MCP23017T-E/ML
подробное описание детали  16-Bit I/O Expander with Serial Interface
PDF  48 Pages
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производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP23017T-E/ML датащи(HTML) 39 Page - Microchip Technology

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© 2007 Microchip Technology Inc.
DS21952B-page 39
MCP23017/MCP23S17
28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]
with 0.55 mm Contact Length
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
28
Pitch
e
0.65 BSC
Overall Height
A
0.80
0.90
1.00
Standoff
A1
0.00
0.02
0.05
Contact Thickness
A3
0.20 REF
Overall Width
E
6.00 BSC
Exposed Pad Width
E2
3.65
3.70
4.20
Overall Length
D
6.00 BSC
Exposed Pad Length
D2
3.65
3.70
4.20
Contact Width
b
0.23
0.30
0.35
Contact Length
L
0.50
0.55
0.70
Contact-to-Exposed Pad
K
0.20
–
–
D
EXPOSED
D2
e
b
K
E2
E
L
N
NOTE 1
1
2
2
1
N
A
A1
A3
TOP VIEW
BOTTOM VIEW
PAD
Microchip Technology Drawing C04-105B



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