© 2005 Microchip Technology Inc.

DS21896B-page 19

MCP1630/MCP1630V

8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated

L

E2

A3

A1

A

TOP VIEW

D

E

EXPOSED

PAD

METAL

D2

BOTTOM VIEW

2

1

b

p

n

(NOTE 1)

EXPOSED

TIE BAR

PIN 1

(NOTE 2)

ID INDEX

AREA

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package may have one or more exposed tie bars at ends.

.031

.000

.055

.047

.008

.012

A3

Contact Thickness

Exposed Pad Length

Exposed Pad Width

Overall Length

Overall Width

Contact Width

Contact Length

(Note 3)

(Note 3)

b

L

E2

D2

E

D

Number of Pins

Pitch

Overall Height

Standoff

Dimension Limits

Units

p

A1

A

n

MIN

0.20 REF.

.008 REF.

.010

.016

.059

.079 BSC

.118 BSC

.065

.012

.061

.020

.067

1.50

1.65

2.00 BSC

3.00 BSC

0.25

0.40

0.20

0.30

1.20

1.39

0.30

0.50

1.55

1.70

MIN

.020 BSC

.001

.035

NOM

INCHES

8

.039

.002

MAX

0.90

MILLIMETERS*

0.50 BSC

0.02

0.00

0.80

NOM

0.05

1.00

MAX

8

2. REF: Reference Dimension, usually without tolerance, for information purposes only.

1. BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Exposed pad varies according to die attach paddle size.

Drawing No. C04-123, Revised 05-05-05

*Controlling Parameter

See ASME Y14.5M

See ASME Y14.5M

JEDEC equivalent: M0-229

Notes:

For DFN samples, contact your Microchip Sales Office for availability..