AD9858SLASHFDPCB datasheet(6/32 Pages) AD

6 / 32 page

AD9858

Rev. C | Page 6 of 32

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Maximum Junction Temperature

150°C

AVDD

4 V

DVDD

4 V

CPVDD

6 V

Digital Input Voltage Range

−0.7 V to +VDD

Digital Output Current

5 mA

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +85°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL PERFORMANCE

Table 3.

Symbol

Description (Using a 2S2P Test Board)

Value (°C/W)

Junction-to-ambient thermal resistance,

0.0 m/sec airflow per JEDEC JESD51-2

(still air)

19.8

JMA

Junction-to-ambient thermal resistance,

1.0 m/sec airflow per JEDEC JESD51-6

(moving air)

15.6

JMA

Junction-to-ambient thermal resistance,

2.0 m/sec airflow per JEDEC JESD51-6

(moving air)

14.6

Junction-to-board thermal resistance,

1.0 m/sec airflow per JEDEC JESD51-8

(moving air)

8.2

Junction-to-case thermal resistance

(die to heat sink) per MIL-STD-883,

Method 1012.1

0.6

ΨJT

Junction-to-top-of-package

characterization parameter, 0 m/sec

airflow per JEDEC JESD51-2 (still air)

0.15

The AD9858 is specified for a case temperature (TCASE). To ensure

that TCASE is not exceeded, an airflow source may be used.

To determine the junction temperature on the application

printed circuit board (PCB),

TJ = TCASE + (ΨJT × PD)

where:

TJ is the junction temperature (°C).

TCASE is the case temperature (°C) measured by the customer at

the top center of package.

ΨJT is found in Table 3.

PD is the power dissipation (see the total power dissipation in

Table 1).

Values of θJA are provided for package comparison and

PCB design considerations. θJA can be used for a first-order

approximation of TJ by the equation

TJ = TA + (θJA × PD)

where TA is the ambient temperature (°C).

Values of θJB are provided for package comparison and PCB

design considerations (see Table 3).

Values of θJC are provided for package comparison and PCB

design considerations when an external heat sink is required

(see Table 3).

EXPLANATION OF TEST LEVELS

100% production tested.

III.

Sample tested only.

IV.

Parameter is guaranteed by design and characterization

testing.

Parameter is a typical value only.

VI.

Devices are 100% production tested at 25°C and guaranteed

by design and characterization testing for industrial

operating temperature range.

ESD CAUTION

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