 2004 Microchip Technology Inc.

DS21460C-page 19

TC7135

44-Lead Plastic Metric Quad Flatpack (KW) 10x10x2 mm Body, Lead Form (MQFP)

* Controlling Parameter

Notes:

Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-022

Drawing No. C04-071

B

D1

E

CH

15

10

5

15

10

5

β

Mold Draft Angle Bottom

15

10

5

15

10

5

α

Mold Draft Angle Top

0.45

0.38

0.30

.018

.015

.012

Lead Width

0.23

0.18

0.13

.009

.007

.005

c

Lead Thickness

11

11

n1

Pins per Side

10.10

10.00

9.90

.398

.394

.390

Molded Package Length

10.10

10.00

9.90

.398

.394

.390

E1

Molded Package Width

13.45

13.20

12.95

.530

.520

.510

D

Overall Length

13.45

13.20

12.95

.530

.520

.510

Overall Width

7

3.5

0

7

3.5

0

φ

Foot Angle

1.03

0.88

0.73

.041

.035

.029

L

Foot Length

0.25

0.15

0.05

.010

.006

.002

A1

Standoff

§

2.10

2.03

1.95

.083

.080

.077

A2

Molded Package Thickness

2.35

.093

A

Overall Height

0.80

.031

p

Pitch

44

44

n

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS*

INCHES

Units

2

1

n

D1

D

B

p

E

E1

#leads=n1

c

β

φ

α

A2

A

CH x 45°

L

Pin 1 Corner Chamfer

Footprint (Reference)

(F)

.063

1.60

.025

.035

.045

0.64

0.89

1.14

(F)

A1

.079

.086

2.00

2.18

§ Significant Characteristic