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L6316

Figure 3. Flip Chip Pinout Diagram - BUMPS DOWN

Note: Minimum pad pitch = 204 um and pad opening (octagonal) = 70 um

Bump Sequence (see next table for coordinates)

Die dimensions:

X = 2192 ±20 um

Y = 2686 ±20 um

Minimum distance between pads opening center to center:

204um

Wafer thickness:

500 ±20 um

Bump height:

90

±15 um

Bump diameter:

120 ±15 um

Die center misalignment w.r.t original die center after cut:

38 um

Bump material if eutectic:

63% Tin, 37% Lead

Bump material if lead free:

96% Tin, 3.5% Silver, 0.5% Copper

Note: VREF PAD can be left floating or grounded. DO NOT CONNECT IT ANYWHERE ELSE.

TF

VEE GND VCC

HR3Y

HR3X

HW3Y

HW3X

HW2X

HW2Y

HW1Y

HW1X

HW0X

HW0Y

HR2Y

HR1Y

HR2X

HR1X

SDEN

WDY

SCLK

RDX

RDY

SDATA

RXW

FLT

WDX

VEE GND VREF VCC

HR0Y

HR0X

0,0