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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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TDA8002CT/C датащи(PDF) 19 Page - NXP Semiconductors |
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TDA8002CT/C датащи(HTML) 19 Page - NXP Semiconductors |
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19 / 28 page  1999 Oct 12 19 Philips Semiconductors Product specification IC card interface TDA8002C VOL(OFF) LOW-level output voltage on pin OFF IOL(OFF) =2mA −− 0.4 V IOL(ALARM) LOW-level output current on pin ALARM VOL(ALARM) =0V −− −5 µA VOH(ALARM) HIGH-level output voltage on pin ALARM IOH(ALARM) = −2mA VDD − 1 −− V tW ALARM pulse width 6 − 20 ms Clock output (CLKOUT; powered from VDD) fCLKOUT frequency on CLKOUT 0 − 20 MHz low power − 16 − kHz VOL LOW-level output voltage IOL = 1 mA 0 − 0.5 V VOH HIGH-level output voltage IOH = −1mA VDD − 0.5 −− V tr, tf rise and fall times CL = 15 pF; notes 3 and 4 −− 8ns δ duty factor CL = 15 pF; notes 3 and 4 40 − 60 % Internal oscillator fint frequency of internal oscillator active mode 2 2.5 3 MHz sleep mode − 32 − kHz Card reset output (RST) VO(inact) output voltage inactive modes 0 − 0.3 V td(RST) delay between RSTIN and RST RST enabled −− 100 ns VOL LOW-level output voltage IOL = 200 µA0 − 0.3 V VOH HIGH-level output voltage IOH = −200 µAVCC − 0.5 − VCC V tr, tf rise and fall times CL =30pF −− 0.5 ns Card clock output (CLK) VO(inact) output voltage inactive modes 0 − 0.3 V VOL LOW-level output voltage IOL = 200 µA0 − 0.3 V VOH HIGH-level output voltage IOH = −50 µAVCC − 0.5 − VCC V tr, tf rise and fall times CL = 30 pF; note 3 −− 8ns δ duty factor CL = 30 pF; note 3 45 − 55 % SR slew rate (rise and fall) 0.2 −− V/ns Strobe input (STROBE) fSTROBE frequency on STROBE 0 − 10 MHz VIL LOW-level input voltage 0 − 0.3VDD V VIH HIGH-level input voltage 0.7VDD − VDD V Logic inputs (CLKSEL, CLKDIV1, CLKDIV2, MODE, CMDVCC and RSTIN); note 5 VIL LOW-level input voltage 0 − 0.3VDD V VIH HIGH-level input voltage 0.7VDD − VDD V SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT |
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