MP5991

– 16V, 50A, 1mΩ RDS(ON), HOT-SWAP INTELLI-FUSE SOLUTION

MP5991 Rev. 1.0

MonolithicPower.com

8

4/27/2022

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ABSOLUTE MAXIMUM RATINGS (1)

VIN (DC).........................................-0.3V to +20V

VIN (1μs) ....................................................... 24V

VIN (25ns) ..................................................... 29V

VOUT ..............................................-0.3V to +20V

All other pins ................................-0.3V to +4.2V

Continuous power dissipation (TA = 25°C) (2)

................................................................. 5.68W

Junction temperature ................................150°C

Lead temperature .....................................260°C

Storage temperature ................ -65°C to +155°C

ESD Ratings (3)

Human body model (HBM) ..................Class 1C

Charged device model (CDM)...........Class C2B

Recommended Operating Conditions (4)

Operating input voltage (VIN)...............4V to 16V

Operating junction temp (TJ) .... -40°C to +125°C

Thermal Resistance (5)

θJA

θJC

LGA-32 (5mmx5mm) ............. 22......10.8 . °C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θ

JA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX) - TA) / θJA. Exceeding the maximum allowable power

dissipation can produce an excessive die temperature, which

may cause the device to go into thermal shutdown. Internal

thermal

shutdown

circuitry

protects

the

device

from

permanent damage.

3) Followed

ANSI/ESDA/JEDEC

JS-001

for

HBM

and

ANSI/ESDA/JEDEC JS-002 for CDM.

4) The device is not guaranteed to function outside of its

operating conditions.

5) Measured on JESD51-7, 4-layer PCB.