2000 Apr 20

19

Philips Semiconductors

Product specification

TDA8003TS

PACKAGE OUTLINE

UNIT

(1)

QZ

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

0.21

0.05

1.80

1.65

0.38

0.25

0.20

0.09

8.4

8.0

5.4

5.2

0.65

1.25

7.9

7.6

0.9

0.7

0.8

0.4

8

0

o

o

0.13

0.1

0.2

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

1.03

0.63

SOT340-1

MO-150

95-02-04

99-12-27

X

θ

A

D

Q

detail X

E

Z

e

c

L

(A )

3

A

112

24

13

0.25

y

pin 1 index

0

2.5

5 mm

scale

SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm

SOT340-1

A

max.

2.0