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EP11 датащи(PDF) 37 Page - Power Integrations, Inc. |
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EP11 датащи(HTML) 37 Page - Power Integrations, Inc. |
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37 / 46 page ![]() 22-Jan-01 EPR-00011 - 70 W Adapter Page 37 of 46 Power Integrations Inc Tel: +1 408 414 9200 Fax: +1 408 414 9201 www: http://www.powerint.com 13 Appendix A - Thermal considerations: The TOPSwitch-GX family significantly extends the power capability over the TOPSwitch-II family of devices. The higher power capability is a result of a lower internal high voltage MOSFET RDS(ON) over that of any previous TOPSwitch-II. This lower RDS(ON) enables compact high power adapters such as the EP11. The output powers of higher power adapter supplies like EP11 are all thermally limited to some degree. One of the important design considerations is often compact size which together with efficiency limitations combine to limit the maximum continuous power of the design. This adapter is no exception. The maximum continuous power is rated at 70 Watts in an enclosure at a 40 °C ambient temperature (see Figure 13). This rating is very “packaging” dependent. The power dissipated by the high voltage MOSFET within the TOP249Y is a significant source of heat. Together with the heat generated in the transformer, output diodes, input rectifier and filter, as well as the output filter must be managed to keep the maximum component temperatures within limits. Layout and heat sinking and the complete package must be designed to manage the heat generated by the board components. Adapters are generally completely enclosed external power sources that provide little or no ventilation for the internal converter components. They are also generally small in size which creates high power densities and necessitates very tight packaging of components. The first and most fundamental performance element to optimise for a successful high power adapter is its efficiency. Other key considerations include; heat sink design, “hot spots”, and maximum component temperatures. |
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