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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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LTC6907 датащи(PDF) 21 Page - Analog Devices |
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LTC6907 датащи(HTML) 21 Page - Analog Devices |
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21 / 24 page  LTC6991 21 Rev. D For more information www.analog.com PACKAGE DESCRIPTION 3.00 ±0.10 (2 SIDES) 2.00 ±0.10 (2 SIDES) NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (TBD) 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 0.40 ±0.10 BOTTOM VIEW—EXPOSED PAD 1.65 ±0.10 (2 SIDES) 0.75 ±0.05 R = 0.115 TYP R = 0.05 TYP 1.35 ±0.10 (2 SIDES) 1 3 6 4 PIN 1 BAR TOP MARK (SEE NOTE 6) 0.200 REF 0.00 – 0.05 (DCB6) DFN 0405 0.25 ±0.05 0.50 BSC PIN 1 NOTCH R0.20 OR 0.25 × 45° CHAMFER 0.25 ±0.05 1.35 ±0.05 (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 1.65 ±0.05 (2 SIDES) 2.15 ±0.05 0.70 ±0.05 3.55 ±0.05 PACKAGE OUTLINE 0.50 BSC DCB Package 6-Lead Plastic DFN (2mm × 3mm) (Reference LTC DWG # 05-08-1715 Rev A) |
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