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APTM50DAM38CTG датащи(PDF) 1 Page - Microsemi Corporation

номер детали APTM50DAM38CTG
подробное описание детали  Boost chopper SiC FWD diode MOSFET Power Module
PDF  7 Pages
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производитель  MICROSEMI [Microsemi Corporation]
домашняя страница  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

APTM50DAM38CTG датащи(HTML) 1 Page - Microsemi Corporation

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APTM50DAM38CTG
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CR1
VBUS
NT C2
0/VBU S
VBUS SENSE
G2
S2
NT C1
Q2
OUT
VBUS
OUT
OUT
NTC2
NTC1
0/VBUS
S2
S2
G2
G2
VBUS
SENSE
Absolute maximum ratings
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
Symbol
Parameter
Max ratings
Unit
VDSS
Drain - Source Breakdown Voltage
500
V
Tc = 25°C
90
ID
Continuous Drain Current
Tc = 80°C
67
IDM
Pulsed Drain current
360
A
VGS
Gate - Source Voltage
±30
V
RDSon
Drain - Source ON Resistance
45
m
PD
Maximum Power Dissipation
Tc = 25°C
694
W
IAR
Avalanche current (repetitive and non repetitive)
46
A
EAR
Repetitive Avalanche Energy
50
EAS
Single Pulse Avalanche Energy
2500
mJ
VDSS = 500V
RDSon = 38mΩ typ @ Tj = 25°C
ID = 90A @ Tc = 25°C
Application
AC and DC motor control
Switched Mode Power Supplies
Power Factor Correction
Features
Power MOS 7® MOSFETs
-
Low RDSon
-
Low input and Miller capacitance
-
Low gate charge
-
Avalanche energy rated
FWD SiC Schottky Diode
-
Zero reverse recovery
-
Zero forward recovery
-
Temperature Independent switching behavior
-
Positive temperature coefficient on VF
Kelvin source for easy drive
Very low stray inductance
-
Symmetrical design
-
Lead frames for power connections
Internal thermistor for temperature monitoring
High level of integration
Benefits
Outstanding performance at high frequency operation
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Solderable terminals both for power and signal for
easy PCB mounting
Low profile
RoHS Compliant
Boost chopper
SiC FWD diode
MOSFET Power Module


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