Figure 50.

Settling time measurement configuration ................................................. 23

Figure 51.

Low-side current sensing schematic .................................................... 24

Figure 52.

SO8 package outline ............................................................... 26

Figure 53.

SO8 recommended footprint.......................................................... 27

Figure 54.

DFN8 3x3 exposed pad, wettable flank package outline and mechanical data........................ 28

Figure 55.

DFN8 3x3 exposed pad, wettable flank footprint data......................................... 29

TSB952

List of figures

DS14576 - Rev 1

page 35/36