Temperature fall rate: max 4 °C/s

To avoid falling off, the Teseo module should be placed on the topside of the motherboard during soldering.

13.2

Repeated reflow soldering

Only single reflow soldering processes are recommended for boards populated with Teseo modules. To avoid

upside down orientation during the second reflow cycle, the Teseo module should not be submitted to two reflow

cycles on a board populated with components on both sides. In this case, the Teseo module should always be

placed on that side of the board which is submitted into the last reflow cycle.

Important:

Repeated reflow soldering processes and soldering the Teseo module upside down are not recommended.

13.3

Rework

The Teseo module can be unsoldered from the baseboard using a hot air gun. When using a hot air gun for

unsoldering the module, a maximum of one reflow cycle is allowed. In general, we do not recommend using a hot

air gun because this is an uncontrolled process and might damage the module.

Attention:

Use of a hot air gun can lead to overheating and severely damage the module. Always avoid overheating the

module.

After the module is removed, clean the pads before placing and hand soldering a new module.

Important:

Never attempt a rework on the module itself, for example, replace individual components. Such actions

immediately terminate the warranty.

Teseo-LIV4F

Reflow soldering profile

DS13957 - Rev 6

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