2

AMI Semiconductor

- Preliminary

www.amis.com

XPressArray-II 0.15m

mm Structured ASIC

Data Sheet

Table 2: XPressArray-II Package Options

3.0 The Advantages of XPressArray-II

XPressArray-II technology is ideal for medium density ASIC

applications requiring high-performance and low power, with

1.5V/1.2V operation. XPressArray-II devices are fabricated

using a hybrid technology that integrates an established

0.15

mm front-end process with a proven AMIS metal finishing

technology, which is used to produce a customized back-end.

The 0.15

mm processing steps are common to multiple

applications, reducing costs by allowing existing tooling to be

utilized. At the same time, tooling and manufacturing costs are

significantly lower for the metal finishing process than for

traditional 0.15

mm cell based processes. The result is that

XPressArray-II delivers reduced cycle times and significant

reductions in terms of both NRE and unit cost through

manufacturing utilizing structured ASIC technology.

The XPressArray-II architecture offers a unique solution to the

challenges of maintaining FPGA process compatibility while

delivering ASIC technology with reasonable NREs and low

piece price. Compared to equivalent FPGAs, XPressArray-II

devices operate at the same voltage, offer higher densities,

better performance and consume less power. Figure 1

compares volume pricing for FPGA, cell-based ASIC and

XPressArray-II

devices.

Figure

2

compares

power

consumption of these devices.

Pins

Description

Pitch (mm)

Size (mm)

Max I/Os

256 FBGA

256 Fine Pitch Ball Grid Array

1.0

17x17

187

456 FBGA

456 Fine Pitch Ball Grid Array

1.0

23x23

344

484 FBGA

484 Fine Pitch Ball Grid Array

1.0

23x23

369

575 PBGA

575 Standard Ball Grid Array

1.27

31x31

423

672 FBGA

672 Fine Pitch Ball Grid Array

1.0

27x27

521

672 PBGA

672 Standard Ball Grid Array

1.27

35x35

514

672 FFBGA

672 Flip-Chip Fine Pitch Ball Grid Array

1.0

27x27

459

676 FBGA

676 Fine Pitch Ball Grid Array

1.0

27x27

500

724 PBGA

724 Standard Ball Grid Array

1.27

35x35

564

728 PBGA

728 Standard Ball Grid Array

1.27

35x35

531

780 FBGA

780 Fine Pitch Ball Grid Array

1.0

29x29

675

896 FFBGA

896 Flip-Chip Fine Pitch Ball Grid Array

1.0

31x31

639

956 PBGA

956 Standard Ball Grid Array

1.27

40x40

747

957 BFBGA

957 Flip-Chip Standard Pitch Ball Grid Array

1.27

40x40

699

1020 FBGA

1020 Fine Pitch Ball Grid Array

1.0

33x33

859

1148 FFBGA

1148 Flip-Chip Fine Pitch Ball Grid Array

1.0

35x35

819

1152 FFBGA

1152 Flip-Chip Fine Pitch Ball Grid Array

1.0

35x35

839

1508 FBGA

1508 Fine Pitch Ball Grid Array

1.0

40x40

1267

1517 FFBGA

1517 Flip-Chip Fine Pitch Ball Grid Array

1.0

40x40

1123

1696 FFBGA

1696 Flip-Chip Fine Pitch Ball Grid Array

1.0

42.5x42.5

1179

1704 FFBGA

1704 Flip-Chip Fine Pitch Ball Grid Array

1.0

42.5x42.5

1131

For FPGA conversions, rapid access to XPressArray-II

technology can be achieved via AMI Semiconductor's

NETRANS® conversion methodology. Alternatively, the

availability of XPressArray-II synthesis libraries for leading

commercial synthesizers allows conversion of FPGA designs

to an ASIC by simply re-targeting from an FPGA library to an

XPressArray-II library.

Comprehensive clock management circuitry features up to

eight all digital delay-locked loops (DLLs) and a maximum of

eight phase-locked loops (PLLs).

High fault coverage is

provided through integrated scan-test, memory BIST and

JTAG support.

Package offerings include traditional plastic BGA and flip-chip

BGA in 1.00mm and 1.27mm pitches. Because XPressArray-

II devices consume significantly less power than equivalent

FPGAs, lower cost plastic packaging can be used in most

cases. Table 2 shows the supported package configurations.

Packaging options exist to optimize individual conversions.