SYMBOL

FUNCTION

SP

Start Pulse: Input to start the line scan.

CP

Clock Pulse: Input to clock the Shift Register.

VDD

Positive Supply: +5 volt supply connected to substrate.

VSS

VSS is tied to ground: Connection topside common

IOUT

Video Signal Current Output from a source follower.

EOS

End of Scan Pulse: Output from the shift register at end of scan.

Table 1. Pad Symbols and Functions

Figure 2. Bonding Pad Layout Diagram:

Figure 2 shows the bonding pad locations for PI3039 Sensor Chip. The locations are referenced to the

lower left corner of the die.

Electro-Optical Characteristics (25

Table 2, below, lists the electro-optical characteristics of PI3039 sensor chip at 25

Parameters

Symbols

Typical

Units

Notes

Number of Photo-elements

192

elements

Pixel-to-pixel spacing

42

µm

Chip scanning rate

38.4

µsec

@ typical 5 MHz pixel rate.

See note 2.

Clock frequency

5.0

MHz

See note 2

IOUT (Saturation charge

output for a given sample time)

At 5.0 MHz clock frequency.

170 to 200

pC

With 570nm light source.

At saturation exposure of

5.7 Joules/cm

2

PAGE 2 OF 10, PI3039, 12/2/02

8080 µm

333 µm

Read Line

PI3039 IMAGE SENSOR, 192 PIXELS, 42 µm PITCH

SP

CP

VDD

VSS

IOUT

EOS

360 µm

NOTE: ALL PAD OPENINGS ARE 140 X 80 µm

SP

CP

VDD

VSS

IOUT

EOS

PAD

FUNCTION

Y

X

START INPUT

CLOCK INPUT

+5 SUPPLY

TIED TO GROUND

VIDEO SIGNAL OUT

SCAN OUTPUT

30

30

30

30

30

30

575

2195

3295

4373

5495

7272

NOTES:

1. THE DRAWING IS NOT TO SCALE.

2. THE DIE LENGTH AND WIDTH ARE GIVEN AS SHOWN.

3. THE PAD LOCATION ARE GIVEN IN THE TABLE.

4. THERE ARE 2 EXAMPLES OF THE X & Y LOCATIONS

SHOWN ON THE FIRST 2 PADS.

5. ALL DIMENSIONS ARE IN µm.

X

X

Y