SYMBOL

FUNCTION

SP

Start Pulse: Input to start the line scan.

CP

Clock Pulse: Input to clock the Shift Register.

VDD

Positive Supply: +5 volt supply connected to substrate.

DGND

Digital Ground: Connection topside common.

IOUT

Signal Current Output: Output for video signal current

EOS

End of Scan Pulse: Output from the shift register at end of scan.

Table 1. Pad Symbols and Functions

Bonding pad layout diagram:

Figure 2 shows the bonding pad locations for PI3012A Sensor Chip relative to the lower left corner of the die.

the die.

Electro-Optical Characteristics (25 C)

Table 2, below, lists the electro-optical characteristics of PI3012A sensor chip at 25

8080 µm

380µm

Y

X

PAD

FUNCTION

Y

X

SP

W C B E

CP

SENSOR DIE

VDD

GND

IOUT

B1 W1

PAGE 2 OF 7 PI3012A, 6/9/99

NOTES:

1. THE DRAWING IS NOT TO SCALE.

2. THE DIE LENGTH AND WIDTH ARE

GIVEN AS SHOWN.

3. THE PAD LOCATIONS ARE GIVEN

IN THE TABLE.

4. THERE ARE TWO EXAMPLES OF

THE X AND Y LOCATIONS SHOWN

ON THE FIRST TWO PADS. THEY

ARE MEASURED TO THE LEFT BOTTOM

CORNER OF THE PAD OPENNING.

5. ALL DIMENSIONS ARE IN µm.

6. TP ARE TEST POINTS, THEY ARE

NOT TO BE BONDED OUT.

NOTE: ALL PAD OPENNINGS ARE 140 X 80 µm

EXCEPT FOR THE TEST PADS, WHICH ARE 80 X 80 µm.

EOS

FIGURE 2. PI3012A PAD LAYOUT AND DIE SIZE.

SP

START INPUT

30

742.5

CP

CLOCK INPUT

30

2767.0

VDD

+ 5 VOLT SUPPLY 30

3124.5

VSS

GROUND

30

3419.0

IOUT

VIDEO SIGNAL OUT

30

5095.5

EOS

SCAN OUTPUT

30

7000.1

W

TP

30

1162.5

C

TP

30

1312.5

B

TP

30

1658.0

E

TP

30

1807.0

B1

TP

30

5407.0

W1

TP

30

5672.0

o

X