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DF005S1 датащи(PDF) 2 Page - ON Semiconductor

номер детали DF005S1
подробное описание детали  Bridge Rectifier
PDF  6 Pages
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производитель  ONSEMI [ON Semiconductor]
домашняя страница  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

DF005S1 датащи(HTML) 2 Page - ON Semiconductor

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DF005S1−DF10S1
www.onsemi.com
2
ABSOLUTE MAXIMUM RATINGS (Values are at TA = 25°C unless otherwise noted.)
Symbol
Parameter
Value
Unit
DF005S1
DF01S1
DF02S1
DF04S1
DF06S1
DF08S1
DF10S1
VRRM
Maximum Recurrent Peak
Reverse Voltage
50
100
200
400
600
800
1000
V
VRMS
Maximum RMS Bridge Input
Voltage
35
70
140
280
420
560
700
V
VDC
Maximum DC Blocking Voltage
50
100
200
400
600
800
1000
V
IF(AV)
Maximum Average Forward
Current TA = 40_C
1.0
A
IFSM
Peak Forward Surge Current
8.3 ms Single Half−Sine Wave
Superimposed on Rated Load
(JEDEC Method)
35
A
TSTG
Storage Temperature Range
−55 to +150
°C
TJ
Operating Junction
Temperature Range
−55 to +150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS (Note 1)
Symbol
Parameter
Conditions
Max.
Unit
RqJA
Thermal Resistance, Junction to Ambient
Single−Die Measurement
(Maximum Land Pattern: 13 × 13 mm)
65
°C/W
Multi−Die Measurement
(Maximum Land Pattern: 13 × 13 mm)
50
Multi−Die Measurement
(Minimum Land Pattern: 1.3 × 1.5 mm)
105
YJL
Thermal Characterization Parameter,
Junction to Lead
Single−Die Measurement
(Maximum and Minimum Land Pattern)
27
°C/W
1. The thermal resistances (RqJA & YJL) are characterized with the device mounted on the following FR4 printed circuit boards, as shown in
Figure 1 and Figure 2. PCB size: 76.2 × 114.3 mm.
Heating effect from adjacent dice is considered and only two dices are powered at the same time.
Figure 1. Maximum Pads of 2 oz Copper
Figure 2. Minimum Pads of 2 oz Copper
F
F
S
S
F
F
S
S
ELECTRICAL CHARACTERISTICS (Values are at TA = 25°C unless otherwise noted.)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VF
Forward Voltage Drop per Bridge Element
IF = 1.0 A
1.1
V
IR
DC Reverse Current
at Rated DC Blocking Voltage
TJ = 25°C
3
mA
TJ = 125°C
500
I2t
Rating for Fusing (t < 8.3 ms)
5.1
A2S
CJ
Junction Capacitance
VR = 4.0 V, f = 1.0 MHz
10
pF
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.



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