LTC1164

15

1164fa

J Package

24-Lead CERDIP (Narrow .300 Inch, Hermetic)

(Reference LTC DWG # 05-08-1110)

OBSOLETE PACKAGE

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

LTC1164 • AC08

124

223

322

421

520

619

0.1µF

0.1µF

82.5k

30.1k

71.5k

44.2k

121k

75k

28.7k

301k

28.7k

124k

68.1k

30.9k

124k

31.1k

40.2k

30.9k

24.3k

30.1k

38.3k

57.6k

118k

ALL RESISTORS MF 1%

0.1µF

7

18

817

916

10

15

11

14

12

13

R2

R2

R4

R4

C

C = 0.001µF

R3

R3

R3

R2

R4

R3

R1

R2

R4

R3

R1

R2

R4

0.1µF

+

–

LT1006

B

B

A

A

D

D

C

C

LTC1164

Figure 16. LTC1164 9th Order Lowpass

LTC1164 • AC07

FREQUENCY (Hz)

1k

–90.00

–70.00

–40.00

10.00

10k

20k

–10.00

–80.00

–60.00

–50.00

–30.00

0.0

–20.00

100:1

J24 0801

.015 – .060

(0.381 – 1.524)

.125

(3.175)

MIN

.014 – .026

(0.360 – 0.660)

.100

(2.54)

BSC

.200

(5.080)

MAX

.045 – .065

(1.143 – 1.651)

.008 – .018

(0.203 – 0.457)

20

16

15

17

14

13

19

11

3

7

56

10

9

12

1

4

2

8

18

.220 – .310

(5.588 – 7.874)

1.290

(32.77)

MAX

21

22

23

24

.025

(0.635)

RAD TYP

NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE

OR TIN PLATE LEADS

0° – 15°

.300 BSC

(7.62 BSC)

.005

(0.127)

MIN

TYPICAL APPLICATIO S

PACKAGE DESCRIPTIO